| 摘要 |
A reticle, a semiconductor chip, and a method of manufacturing a semiconductor device are provided to reduce an area of a TEG(Test Element Group) chip pattern to increase the number of the semiconductor chip per one wafer. A reticle comprises a plurality of semiconductor chip areas and a TEG(Test Element Group) chip pattern area(4a,4b). The semiconductor chip areas are arranged in one direction. The TED chip pattern area is formed between the semiconductor chip areas. A total length of the lengths of one direction of the TEG chip pattern area is equal practically to the length of one direction of the semiconductor chip pattern area. |
