| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device made by stacking a plurality of semiconductor chips via adhesive films while preventing the adhesive films from protruding out of the semiconductor chips, and also to provide its manufacturing method. <P>SOLUTION: The semiconductor device comprises a plurality of semiconductor chips 13, 15 and 17 stacked on a substrate 11 via the adhesive films 12, 14 and 16; a plurality of connecting conductors 22, 23, 24 for electrically connecting bonding pads 18, 19 and 20 formed on the semiconductor chips 13, 15 and 17 to a plurality of bonding pads 21 formed on the substrate 11; and a resin 27 for molding the plurality of semiconductor chips 13, 15 and 17 and the plurality of connecting conductors 22, 23 and 24. The adhesive films 12, 14 and 16 are smaller in size than the semiconductor chips 13, 15 and 17 placed on the adhesive films 12, 14 and 16. <P>COPYRIGHT: (C)2008,JPO&INPIT |
