| 摘要 |
<p>PURPOSE: A releasable adhesive agent is provided to lower adhesion by curing reaction through radiation irradiation and to minimize contamination of a semiconductor wafer by reducing liquid permeability. CONSTITUTION: A releasable adhesive agent comprises a radiation-reactive polymer and a radiation polymerization initiator. The radiation-reactive polymer has a side chain derived from at least one monomer expressed by the formula(1): CH 2 =CR1COOR2, wherein R1 is a hydrogen atom or a methyl group, and R2 is a C6 or higher alkyl group, and a side chain having one carbon-carbon double bond, and the monomer of formula(1) is contained in a ratio of less than 50 mol% with respect to the total monomer constituting the main chain of the radiation-reactive polymer.</p> |
