| 发明名称 |
Three dimensional electronic patch |
| 摘要 |
A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion. |
| 申请公布号 |
US2016171363(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
US201514814347 |
申请日期 |
2015.07.30 |
| 申请人 |
VivaLnk Limited (Cayman Islands) |
发明人 |
Mei Junfeng;Wang Zhigang |
| 分类号 |
G06K19/077;A61B5/01;A61B5/00;H01Q1/27 |
主分类号 |
G06K19/077 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A three-dimensional electronic patch, comprising:
a flat flexible circuit substrate, comprising:
an elastic layer including a first portion and a second portion, wherein the second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer; a first sensor on the first portion of the elastic layer; a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor; and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor, wherein the second portion is folded to position the conductive layer away from the first portion. |
| 地址 |
Santa Clara CA US |
