发明名称 METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD AND FLEXIBLE CIRCUIT BOARD MANUFACTURED BY THE METHOD
摘要 The present invention relates to a flexible printed circuit board and a manufacturing method thereof and, more specifically, to a manufacturing method of a flexible printed circuit board and the flexible printed circuit board, capable of simultaneously forming a metal layer in a via hole and an intaglio pattern so as to secure the same surface roughness of the metal layer and simplify a manufacturing process.
申请公布号 KR20160086609(A) 申请公布日期 2016.07.20
申请号 KR20150004161 申请日期 2015.01.12
申请人 AMOSENSE CO., LTD. 发明人 DAN, SUNG BAEK;HWANG, JIN SU;PARK, HYO JIN
分类号 H05K3/46;H05K3/40 主分类号 H05K3/46
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