发明名称 |
METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD AND FLEXIBLE CIRCUIT BOARD MANUFACTURED BY THE METHOD |
摘要 |
The present invention relates to a flexible printed circuit board and a manufacturing method thereof and, more specifically, to a manufacturing method of a flexible printed circuit board and the flexible printed circuit board, capable of simultaneously forming a metal layer in a via hole and an intaglio pattern so as to secure the same surface roughness of the metal layer and simplify a manufacturing process. |
申请公布号 |
KR20160086609(A) |
申请公布日期 |
2016.07.20 |
申请号 |
KR20150004161 |
申请日期 |
2015.01.12 |
申请人 |
AMOSENSE CO., LTD. |
发明人 |
DAN, SUNG BAEK;HWANG, JIN SU;PARK, HYO JIN |
分类号 |
H05K3/46;H05K3/40 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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