Transdermal medical patch

摘要

A medical patch having a multi-piece bottom liner including a central liner sequentially removable independently of two outer perimeter liners. The multi-piece liner covering two adhesives of different peel force. Removal of the central liner exposes a first temporary/repositionable adhesive. Once properly positioned, the outer perimeter liners are removed to expose a second stronger adhesive. A foam cushioning layer is disposed beneath and extends beyond a footprint of every printed circuit board to prevent skin irritation. The medical patch may be designed specifically for stimulation of the sacral (S3 foramen) spinal nerve without the use of a separate mechanical placement tool or assistance by another.

主权项

1. A medical patch having an outer perimeter extending between a leading end and a trailing end, the medical patch comprising:
electronic circuitry including at least one primed circuit board; and a cushioning layer having a bottom surface, an opposite top surface, a side surface and an outer perimeter; the at least one printed circuit board is disposed on the top surface of the cushioning layer; the outer perimeter of the cushioning layer extending two dimensionally in all directions beyond a footprint of each of the at least one printed circuit hoard, wherein some of the at least one printed circuit boards has at least one surface mounted electronic component secured thereto; a polymer layer bonded to and enclosing the top surface of each of the at least one printed circuit board having the at least one surface mounted electronic component; and the polymer layer is in contact with only a portion of the cushioning layer not covered by the at least one printed circuit board; the polymer layer being, disposed inward from the outer perimeter of the cushioning layer; the polymer layer enhancing rigidity of the medical patch while hermetically sealing the electronic circuitry from air and moisture; and a top coat completely enclosing the polymer layer and extending to the outer perimeter of the cushioning layer; the top coat providing a water resistant barrier for the electronic circuitry and the polymer layer disposed beneath the top coat.