发明名称 SEMICONDUCTOR DEVICE HAVING A SEALING LAYER COVERING A SEMICONDUCTOR MEMORY UNIT AND A MEMORY CONTROLLER
摘要 A semiconductor device includes a substrate, a semiconductor memory unit mounted on a surface of the substrate, a memory controller configured to control the semiconductor memory unit and mounted on the surface of the substrate adjacent to the semiconductor memory unit, and a sealing layer disposed on the surface of the substrate and covering the semiconductor memory unit and the memory controller.
申请公布号 US2016268229(A1) 申请公布日期 2016.09.15
申请号 US201514837997 申请日期 2015.08.27
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MATSUMOTO Manabu;TANIMOTO Akira;OZAWA Isao
分类号 H01L25/065;H01L21/56;H01L23/00;H01L25/00;H01L23/31 主分类号 H01L25/065
代理机构 代理人
主权项 1. A semiconductor device comprising: a substrate including a host interface on an edge thereof; a semiconductor memory unit mounted on a surface of the substrate; a memory controller configured to control the semiconductor memory unit and mounted on the surface of the substrate adjacent to the semiconductor memory unit, the memory controller including a host interface section configured to receive data from and transmit data to the host interface, the host interface section being positioned adjacent to an edge of the memory controller that faces said edge of the substrate; and a sealing layer disposed on the surface of the substrate and covering the semiconductor memory unit and the memory controller.
地址 Tokyo JP