发明名称 |
ULTRASONIC SENSOR AND MANUFACTURING METHOD FOR THE SAME |
摘要 |
An ultrasonic sensor includes: a substrate disposed across an XY plane; a plurality of spaces formed in the substrate in at least one direction of an X-axis direction and a Y-axis direction; a vibrating plate that is provided on the substrate such that the spaces are enclosed and that has a first surface on the substrate side and a second surface facing the first surface; a piezoelectric element that is provided at a portion on the second surface side of the vibrating plate that corresponds to the space and that transmits and/or receives an ultrasonic wave; a surrounding plate that is provided on the second surface side of the vibrating plate and surrounds a peripheral region of the piezoelectric element; and a support member provided at a position, at which the support member is not overlapped with the piezoelectric element, between a surface of the surrounding plate on the piezoelectric element side and the second surface of the vibrating plate. |
申请公布号 |
US2016282454(A1) |
申请公布日期 |
2016.09.29 |
申请号 |
US201615076999 |
申请日期 |
2016.03.22 |
申请人 |
Seiko Epson Corporation |
发明人 |
OHASHI Koji;KOJIMA Chikara;IWAI Hikaru |
分类号 |
G01S7/521;G01S7/526;H01L41/25;G01S7/524 |
主分类号 |
G01S7/521 |
代理机构 |
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代理人 |
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主权项 |
1. An ultrasonic sensor comprising:
when two orthogonal axes are referred to as an X axis and a Y axis and a plane formed by the X axis and the Y axis is referred to as an XY plane, a substrate disposed across the XY plane; a plurality of spaces formed in the substrate in at least one direction of an X-axis direction and a Y-axis direction; a vibrating plate that is provided on the substrate such that the spaces are enclosed and that has a first surface on the substrate side and a second surface facing the first surface; a piezoelectric element that is provided at a portion on the second surface side of the vibrating plate that corresponds to the space and that transmits and/or receives an ultrasonic wave; a surrounding plate that is provided on the second surface side of the vibrating plate and that surrounds a peripheral region of the piezoelectric element; and a support member provided at a position, at which the support member is not overlapped with the piezoelectric element, between a surface of the surrounding plate on the piezoelectric element side and the second surface of the vibrating plate. |
地址 |
Tokyo JP |