发明名称 ULTRASONIC SENSOR AND MANUFACTURING METHOD FOR THE SAME
摘要 An ultrasonic sensor includes: a substrate disposed across an XY plane; a plurality of spaces formed in the substrate in at least one direction of an X-axis direction and a Y-axis direction; a vibrating plate that is provided on the substrate such that the spaces are enclosed and that has a first surface on the substrate side and a second surface facing the first surface; a piezoelectric element that is provided at a portion on the second surface side of the vibrating plate that corresponds to the space and that transmits and/or receives an ultrasonic wave; a surrounding plate that is provided on the second surface side of the vibrating plate and surrounds a peripheral region of the piezoelectric element; and a support member provided at a position, at which the support member is not overlapped with the piezoelectric element, between a surface of the surrounding plate on the piezoelectric element side and the second surface of the vibrating plate.
申请公布号 US2016282454(A1) 申请公布日期 2016.09.29
申请号 US201615076999 申请日期 2016.03.22
申请人 Seiko Epson Corporation 发明人 OHASHI Koji;KOJIMA Chikara;IWAI Hikaru
分类号 G01S7/521;G01S7/526;H01L41/25;G01S7/524 主分类号 G01S7/521
代理机构 代理人
主权项 1. An ultrasonic sensor comprising: when two orthogonal axes are referred to as an X axis and a Y axis and a plane formed by the X axis and the Y axis is referred to as an XY plane, a substrate disposed across the XY plane; a plurality of spaces formed in the substrate in at least one direction of an X-axis direction and a Y-axis direction; a vibrating plate that is provided on the substrate such that the spaces are enclosed and that has a first surface on the substrate side and a second surface facing the first surface; a piezoelectric element that is provided at a portion on the second surface side of the vibrating plate that corresponds to the space and that transmits and/or receives an ultrasonic wave; a surrounding plate that is provided on the second surface side of the vibrating plate and that surrounds a peripheral region of the piezoelectric element; and a support member provided at a position, at which the support member is not overlapped with the piezoelectric element, between a surface of the surrounding plate on the piezoelectric element side and the second surface of the vibrating plate.
地址 Tokyo JP