发明名称 TRANSPARENT FLEXIBLE PACKAGE SUBSTRATE AND FLEXIBLE OLED PACKAGE METHOD
摘要 The present invention provides a transparent flexible package substrate and a flexible OLED package method, comprising: a flexible glass (2), an insulative glue layer (1) located at one side of the flexible glass (2), a polymer layer (3) located at the other side of the flexible glass (2); a surface dimension of the flexible glass (2) is larger than a surface dimension of the polymer layer (3); a surface dimension of the flexible glass (2) is smaller than or equal to a surface dimension of the insulative glue layer (1). The transparent flexible package substrate possesses well flexibility and properties of excellent anti-water, anti-oxygen abilities, and manufactured with flexible glass material, which is a transparent flexible package substrate capable of being widely utilized and applicable for packages of many kinds of OLED display elements.
申请公布号 US2016343993(A1) 申请公布日期 2016.11.24
申请号 US201514424536 申请日期 2015.02.09
申请人 SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO.,LTD. 发明人 ZOU Qinghua;WANG Yifan
分类号 H01L51/56;H01L51/00;B32B17/06;H01L51/52 主分类号 H01L51/56
代理机构 代理人
主权项 1. A transparent flexible package substrate, comprising: a flexible glass, an insulative glue layer located at one side of the flexible glass, a polymer layer located at the other side of the flexible glass; a surface dimension of the flexible glass is larger than a surface dimension of the polymer layer; a surface dimension of the flexible glass is smaller than or equal to a surface dimension of the insulative glue layer.
地址 Shenzhen, Guangdong CN
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