| 摘要 |
PROBLEM TO BE SOLVED: To correct the polishing surfaces of an upper surface table and a lower surface table efficiently and automatically with simple constitution in a double-side polishing device provided with a carrier put in circular motion without rotation. SOLUTION: A double-side polishing device is provided with a carrier 12 with a through hole provided in a thin plate; an upper surface table 14 and a lower surface table 16 moved relatively to a wafer to polish it; carrier turning motion mechanism 20 putting the carrier 12 in circular motion without rotation and putting the wafer held between the upper surface table 14 and lower surface table 16, in turning motion in a through hole; an upper surface table elevating device 40 for elevating the upper surface table 14 so as to approach and separate from the carrier 12; a carrier elevating device 65 for elevating the carrier 12 so as to approach and separate from the lower surface table 16; a correcting means provided to advance/retreat between the upper surface table 14 and the carrier 12 so as to correct a polishing surface 14a of the lower surface table 14; and a correcting means provided to advance/retreat between the lower surface table 16 and the carrier 12 so as to correct a polishing surface 16a of the lower surface table 16. |
