| 摘要 |
<p>A single layer surface mount package suitable for use with a high frequency microelectronic device includes a lead frame partially embedded in a dielectric material and a lid. The dielectric material is integrally formed or molded into the cavities between the leads and die attach area of the lead frame such that at least the die attach area remains exposed on the top and the bottom surface of the dielectric material. A sufficient length of each lead remains exposed beyond the perimeter of the dielectric material for surface mounting to a circuit of a next level assembly.</p> |
