| 摘要 |
<p>A film forming method and a film forming device capable of forming a film on a substrate with a large area; the film forming method for forming the film by spattering a film forming material from the surface of a target material (14) to deposit the spattered film forming material on the surface of the substrate (12), comprising the steps of disposing the substrate (12) and the target material (14) so that the surface of the substrate (12) forms an angle relative to the surface of the target material (14) and forming the film on the substrate (12) so that the area of the surface of the film is continuously increased two-dimensionally while moving the relative position of the substrate (12) to the target material (14).</p> |
