发明名称 A COMPACT AND RELIABLE PRESS FOR PACKAGING SEMICONDUCTOR DEVICES
摘要 <p>The present invention is an electromechanical press (10) that features a separate clamping mechanism from the closing and opening mechanism for the mould (74). By incorporating a clamping assembly and a clamping plate (40) in a transfer mould press, the present invention directs the clamping forces onto the cavities. In the process, the reaction forces from the clamping operation is deflected to the top and bottom plates (15, 25) of the press instead of the supporting plates (42) for the mould halves. As such, the cavties of the mould are closed fittingly at the critical moment and leakage of resin from the transfer operation is greatly minimised. It follows that a thinner clamping plate can be used without comprising the yiels of the overall packaging process. By employing a transfer ball scre (54) for the clamping mechanism, the present invention directs the clamping force onto the leadframe without dssipating energy to the peripheral area of the moud set.</p>
申请公布号 WO2002063673(A1) 申请公布日期 2002.08.15
申请号 SG2002000015 申请日期 2002.02.01
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址