| 摘要 |
A wafer lifting apparatus of semiconductor device manufacturing equipment is provided to prevent first particles of a process chamber from penetrating into a bellows and to restrain second particles of the bellows from penetrating into an electrostatic chuck or the process chamber by using an O-ring. A wafer lifting apparatus of semiconductor device manufacturing equipment includes an electrostatic chuck, lift pins, a bellows, and an air flow blocking layer. The electrostatic chuck(100) is used for loading a wafer. The electrostatic chuck includes a plurality of lift pin insertion holes. The lift pins(104) are inserted into the lift pin insertion holes in order to move the wafer of the electrostatic chuck up and down. The bellows(106) is installed at a lower portion of the lift pin in order to move the lift pin up and down. The air flow blocking layer is installed at an internal connection path between the lift pin insertion hole and the bellows in order to block the air flow between a process chamber and the bellows. An O-ring(108) is used as the air flow blocking layer.
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