| 摘要 |
A tape carrier for a tape automated bonding is provided to improve an attachment property between a conductive pattern and a base insulation layer by forming a thermoplastic polyimide resin on a surface of the base insulation layer. A tape carrier includes a base insulation layer(2) and a conductive pattern(7). The base insulation layer includes a thermoplastic polyimide resin layer with a thickness less than 4mum as a surface layer. The conductive pattern is formed on the base insulation layer. The conductive pattern includes a connection terminal, which is connected to a gold terminal of a semiconductor device. A tin plating layer is formed on a surface of the connection terminal. A glass transition point of the thermoplastic polyimide resin layer is lower than 350‹C. The base insulation layer includes a thermosetting polyimide resin layer, on which the thermoplastic polyimide resin layer is formed. A line expansion coefficient of the thermosetting polyimide resin layer is less than 30ppm/‹C. |
