| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor sealing, excellent in low warping property in an area surface mounting type semiconductor package and having characteristics excellent in solder reflow resistance and burning resistance. <P>SOLUTION: The resin composition for semiconductor sealing comprises (A) an epoxy resin containing an epoxy resin (a1) represented by general formula (1) (wherein R1 and R2 are each hydrogen or ≤4C hydrocarbon group and they may mutually be same or different; average value of n1 is an integer of 0 or ≤5), (B) a compound having two or more phenolic hydroxy groups, (C) an inorganic filler, (D) a curing accelerator and (E) polyethylene oxide wax. <P>COPYRIGHT: (C)2007,JPO&INPIT |
