| 摘要 |
A module that can not only achieve the reduction in size and manufacturing cost but also be impervious to noise due to electromagnetic waves, and a mounted structure using the same are provided. A module ( 1 ) includes a substrate ( 12 ) and a plurality of semiconductor packages ( 11 a , 11 b), each including a semiconductor chip ( 10 ), mounted on the substrate ( 12 ). Each of the plurality of semiconductor packages ( 11 a , 11 b) includes a first radio communication element ( 16 ) for transmitting and receiving a signal between the semiconductor chips ( 10 ) in the plurality of semiconductor packages ( 11 a , 11 b) by radio communication, and the first radio communication element ( 16 ) is constituted independently of the semiconductor chip ( 10 ). |
