发明名称 METHOD FOR PEELING FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for peeling a film by which the film comprising a cured product can easily be peeled from a substrate to allow reuse of the substrate, as a method for peeling from a substrate a film comprising a cured product obtained by applying a photosensitive composition on the substrate and curing it. <P>SOLUTION: A photosensitive composition 1 containing a condensate (A) of an alkoxysilane, a first stimulant (B) which is activated by a stimulus to crosslink the condensate (A) of the alkoxysilane, and a second stimulant (C) which is activated by a stimulus different from the stimulus activating the first stimulant (B) is applied on a substrate 2, and a film 1C comprising a cured product obtained by curing the photosensitive composition 1 by applying the stimulus activating the first stimulant (B) to the photosensitive composition 1 is peeled from the substrate 2 by applying the stimulus activating the second stimulant (C) to the film 1C. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008224872(A) 申请公布日期 2008.09.25
申请号 JP20070060490 申请日期 2007.03.09
申请人 SEKISUI CHEM CO LTD 发明人 NAKAMURA HIDE;AZUMA KENICHI;KUSAKA YASUNARI;SASAKI HIROSHI
分类号 G03F7/42;G03F7/075;H01L21/027 主分类号 G03F7/42
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