发明名称 |
METHOD FOR FABRICATING SENSING DEVICE |
摘要 |
A method for fabricating a sensing device includes the following steps. Firstly, an adhering process is performed to attach a sensing integrated circuit on a first circuit board, wherein the sensing integrated circuit has a sensing surface. Then, a packaging process is performed to encapsulate the first circuit board within a package shell, so that at least a portion of a top surface of the first circuit board is covered by the package shell. The sensing surface of the sensing integrated circuit is exposed to a top surface of the package shell. Afterwards, a protective layer is attached on the sensing surface. |
申请公布号 |
US2016212861(A1) |
申请公布日期 |
2016.07.21 |
申请号 |
US201514665240 |
申请日期 |
2015.03.23 |
申请人 |
Primax Electronics Ltd. |
发明人 |
CHENG CHIA-CHU;CHU CHIH-CHUANG |
分类号 |
H05K3/28;H05K3/36;G06K9/00;H05K3/30 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
1. A method for fabricating a sensing device, the method comprising steps of:
performing an adhering process of attaching a sensing integrated circuit on a first circuit board, wherein the sensing integrated circuit has a sensing surface; performing a packaging process of encapsulating the first circuit board within a package shell, so that at least a portion of a top surface of the first circuit board is covered by the package shell, wherein the sensing surface of the sensing integrated circuit is exposed to a top surface of the package shell; and attaching a protective layer on the sensing surface. |
地址 |
Neihu TW |