发明名称 Joined structural body of members, joining method of members, and package for containing an electronic component
摘要 According to one embodiment, a joined structural body for mounting an electronic component on the body which is provided with a first member, a second member and a joining portion. The joining portion is provided between the first member and the second member so as to connect the first member and the second member with each other mechanically. The joining portion contains at least one metal of a tin, an indium or a zinc, and a copper. The content of the metal in the joining portion decreases toward a side of at least one of the first member and the second member, and the content of the copper in the joining portion increases in the same direction as the decreasing direction of the content of the metal.
申请公布号 US9357644(B2) 申请公布日期 2016.05.31
申请号 US201414524282 申请日期 2014.10.27
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 Takagi Kazutaka
分类号 H01L23/047;H05K1/09;H01L23/10;H05K1/11;H01L23/66 主分类号 H01L23/047
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A package containing an electronic component, comprising: a substrate on which an electronic component is mounted; a frame body which surrounds a portion on which the electronic component is mounted, the frame body being joined mechanically with the substrate via a joining portion containing (1) at least one metal of a tin, an indium, or a zinc, and (2) a copper: and feed through terminals for inputting a signal into the electronic component and for outputting a signal from the electronic component respectively, wherein content of the at least one metal in the joining portion decreases toward a side of at least one of the substrate or the frame body, and content of the copper in the joining portion increases in a same direction as the decreasing direction of the content of the at least one metal, and wherein the joining portion includes a first joining portion and a second joining portion, and the substrate and the feed through terminals are joined together via the first joining portion, and the frame body and the feed through terminals are joined together via the second joining portion.
地址 Minato-ku JP