| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a high function and multifunctionality by reducing the size and thickness, and by high-density mounting as well as to promote manufacturing efficiency and to improve an yield. <P>SOLUTION: A component mounting substrate layer body 3 is made by peeling off a dummy substrate 7 from a component mounting substrate 2, wherein a mount component 13 whose input/output electrode formation plane 17 is nearly flush with the principal plane of a silicon substrate 6 is embedded in a component embedding opening 14 formed in the silicon substrate 6, by a component mounting substrate formation process by a sealing resin layer 15. The component mounting substrate layer body 3 is integrated together with an interconnection layer board 4 having an interconnection layer 23 which is formed very accurately by an interconnection layer board formation process using a dummy substrate 9. <P>COPYRIGHT: (C)2007,JPO&INPIT |
