| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To more surely mount components, by eliminating glass components which come up onto a conductor pattern of a substrate surface, according to calcination of a low-temperature calcination ceramic (LTCC) substrate, to improve plating performance to the conductor pattern, while averting damages to a substrate, resulting from the chemical treatment. <P>SOLUTION: This method comprises a conductor pattern formation step of forming a conductor pattern made from a material of silver or copper mixed with glass on a surface of the LTCC substrate; a calcination step of calcinating the LTCC substrate; a blast processing step of performing blast processing by wet blasting to the surface of the LTCC substrate on which the conductor pattern has been formed, thereby eliminating the glass which comes up onto the surface of the conductor pattern; a plating step of plating the conductor pattern on which the blast processing has been performed; and a component mounting step of positioning electronic components to the LTCC substrate, by recognizing the plated conductor pattern as an image and mounting the electronic components on the surface of the LTCC substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
