APPARATUS FOR DEPOSITION AND SUBSTRATE ALIGNMENT METHOD IN THE SAME

摘要

A deposition apparatus includes a sheet, an edge portion of which is integrally combined with a sheet frame, an electrostatic chuck attached to a bottom surface of the sheet, the electrostatic chuck adhering a substrate by a force of static electricity, a metal mask located below the electrostatic chuck, an edge portion of the metal mask being combined with a mask frame, the metal mask having a predetermined patterned opening, and the substrate being mounted to the upper surface of the metal mask, a transfer member coupled to a side surface of the sheet frame, the transfer member flattening the sheet by pulling the sheet to side directions, and a magnetic plate located above the sheet, the magnetic plate closely attaching the substrate to the electrostatic chuck by pulling the metal mask using a magnetic force.

主权项

1. A deposition apparatus, comprising:
a sheet, an edge portion of which is integrally combined with a sheet frame; an electrostatic chuck attached to a bottom surface of the sheet, the electrostatic chuck adhering a substrate by a force of static electricity; a metal mask located below the electrostatic chuck, an edge portion of the metal mask being combined with a mask frame, the metal mask having a predetermined patterned opening, and the substrate being mounted to the upper surface of the metal mask; a transfer member coupled to a side surface of the sheet frame, the transfer member flattening the sheet by pulling the sheet to side directions; and a magnetic plate located above the sheet, the magnetic plate closely attaching the substrate to the electrostatic chuck by pulling the metal mask using a magnetic force.