| 摘要 |
PROBLEM TO BE SOLVED: To mount an electronic element to a position in which the electronic element is provided onto a circuit substrate with high positioning accuracy using the surface tension of solder without providing a special portion for positioning the electronic element or the circuit substrate.SOLUTION: When an electronic element 101 in which mounting terminals 103a to 103f are disposed to parallel and opposite sides 107 and 109, and the mounting terminals 103a to 103f are positioned at a position that is not axial symmetry to a middle line 111 of the sides 107 and 109 is mounted to a circuit substrate by surface mounting, mounting lands 129a to 129f, which are provided to the circuit substrate so as to correspond the mounting terminals 103a to 103f and are coated with solder, are formed so that a resultant force 140a of a force operating to the mounting terminals 103a, 103c, and 103e disposed to the side 107 by surface tension at melting the solder and the resultant force 140a of the force operating to the mounting terminals 103b, 103d, and 103f disposed to the side 109 are balanced.SELECTED DRAWING: Figure 1 |
