| 摘要 |
An LED reflective structure comprising an LED reflective substrate (10). Several partitioning and reflecting cavities (11) are provided on the substrate (10). The partitioning and reflecting cavities (11) are bonded together in a dense distribution. One partitioning rib plate (12) is provided between every two of the partitioning and reflective cavities (11). LED chips are separated on the substrate (10) by the partitioning rib plates (12), thus allowing light rays emitted by the LED chips to be reflected laterally and free from interfering with each other. A nano-reflective material (123) is sprayed onto the lateral surface of the inner wall of the partitioning and reflecting cavities (11) to increase the radiant flux of illumination. The partitioning rib plates (12) have strong compressive strength and provide reinforced protection for chips provided therein. The housing-integrated substrate (10) is capable of integrating protection, thermal conductivity, and heat dissipation functions into one, thus facilitating ultra-thinned, streamlined, and miniaturization designs for a product. |
