发明名称 |
SOLID STATE IMAGING DEVICE, SOLID STATE IMAGING ELEMENT, METHOD FOR MANUFACTURING SOLID STATE IMAGING DEVICE, AND METHOD FOR MANUFACTURING SOLID STATE IMAGING ELEMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid state imaging device, a solid state imaging element, a method for manufacturing the solid state imaging device, and a method for manufacturing the solid state imaging element that are capable of improving image quality. <P>SOLUTION: A solid state imaging device comprises: a sensor substrate with a plurality of pixels formed on an upper face; a microlens array substrate with a plurality of microlenses formed thereon; and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013085212(A) |
申请公布日期 |
2013.05.09 |
申请号 |
JP20120007150 |
申请日期 |
2012.01.17 |
申请人 |
TOSHIBA CORP |
发明人 |
SUZUKI KAZUHIRO;UENO RISAKO;KWON HONAM;KOBAYASHI MITSUYOSHI;FUNAKI HIDEYUKI |
分类号 |
H04N5/225;H01L27/14 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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