发明名称 SOLID STATE IMAGING DEVICE, SOLID STATE IMAGING ELEMENT, METHOD FOR MANUFACTURING SOLID STATE IMAGING DEVICE, AND METHOD FOR MANUFACTURING SOLID STATE IMAGING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid state imaging device, a solid state imaging element, a method for manufacturing the solid state imaging device, and a method for manufacturing the solid state imaging element that are capable of improving image quality. <P>SOLUTION: A solid state imaging device comprises: a sensor substrate with a plurality of pixels formed on an upper face; a microlens array substrate with a plurality of microlenses formed thereon; and a connection post with one end bonded to a region between the microlenses on the microlens array substrate and with the other end bonded to the upper face. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013085212(A) 申请公布日期 2013.05.09
申请号 JP20120007150 申请日期 2012.01.17
申请人 TOSHIBA CORP 发明人 SUZUKI KAZUHIRO;UENO RISAKO;KWON HONAM;KOBAYASHI MITSUYOSHI;FUNAKI HIDEYUKI
分类号 H04N5/225;H01L27/14 主分类号 H04N5/225
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