发明名称 |
APPARATUS FOR TREATING SUBSTRATES BY PROCESS LIQUIDS, AND METHOD OF TREATING SUBSTRATES BY PROCESS LIQUIDS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a treatment apparatus capable of uniformly treating a substrate over the whole thereof by means of treating liquid. <P>SOLUTION: The treatment apparatus of treating the substrate by means of the treating liquid is provided with a conveyance roller 6 which conveys the substrate in a prescribed direction, a nozzle body 12 which is arranged on the upper side of the substrate conveyed by the conveyance roller 6 and has a slit-like nozzle 18 of supplying the treating liquid almost over the whole length of the substrate and a controller 11 which, when the treating liquid is supplied from the nozzle body to the front end part and the rear end part of the conveyance direction of the substrate conveyed by the conveyance roller, retards a conveyance speed of the substrate as compared with the case when the treating liquid is supplied to the other part except the front end part and the rear end part. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
KR20050061364(A) |
申请公布日期 |
2005.06.22 |
申请号 |
KR20040106892 |
申请日期 |
2004.12.16 |
申请人 |
SHIBAURA MECHATRONICS CORP. |
发明人 |
NISHIBE YUKINOBU;ISO AKINORI |
分类号 |
G02F1/13;B08B3/02;H01L21/00 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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