发明名称 ID label, ID tag, and ID card
摘要 In commercial products to which a non-contact type or contact type ID label or ID tag is attached and ID cards, there is fear that, due to a difference between coefficients of thermal expansion between an antenna for communication and a resin provided around the antenna, stress is applied to the resin with the larger coefficient of thermal expansion to break the resin. This contributes to decrease in manufacturing yield, lifetime, and reliability of an ID label or the like. In an article such as an ID label, an ID tag, and an ID card according to the present invention, a filler is included in a filling layer provided around an antenna forming an ID label, an ID tag, and an ID card so that the difference in coefficient of thermal expansion between the antenna and the filling layer can be reduced. This makes it possible to ease generation of stress due to the difference in coefficient of thermal expansion and prevent peeling and cracks of the filling layer.
申请公布号 US2005168339(A1) 申请公布日期 2005.08.04
申请号 US20050044609 申请日期 2005.01.28
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 ARAI YASUYUKI;AKIBA MAI;TACHIMURA YUKO;KANNO YOHEI
分类号 G06K19/077;G08B13/14;(IPC1-7):G08B13/14 主分类号 G06K19/077
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