发明名称 |
APPARATUS AND METHOD OF LASER IRRADIATING |
摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus of laser irradiating which can perform a laser treatment uniformly to a whole semiconductor film surface and to provide a method of laser irradiating. SOLUTION: A laser beam oscillated from a large laser crystal of a wavelength region and a beam homogenizer are used. Since the laser beam with the large wavelength region has weak coherence, a semiconductor film is not made to produce an interference pattern by an interference. Moreover, since a line beam exceeding several meters in the length of a transverse axis can be formed, the throughput of a laser anneal process is improved. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006156984(A) |
申请公布日期 |
2006.06.15 |
申请号 |
JP20050313837 |
申请日期 |
2005.10.28 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
TANAKA KOICHIRO;YAMAMOTO YOSHIAKI |
分类号 |
H01L21/268;H01L21/20;H01L21/336;H01L29/786 |
主分类号 |
H01L21/268 |
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