| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring device in which the part other than a to-be-worked part does not receives a bad influence when working is performed using a laser beam. SOLUTION: A substrate 301 is overlaid with a lower insulating layer 302 consisting of a silicon oxide film, a lower wiring layer 303 consisting of an Al, an upper insulating layer 304 consisting of a polyimide, and an upper wiring layer 306 consisting of the Al. The lower wiring layer 303 is electrically connected to the upper wiring layer 306 with a connection wiring 308. The lower insulating layer 302 has a high thermal conductivity compared with the substrate 301, so that the heat accumulated at the lower wiring layer 303 by the laser when an opening in the upper insulating layer 304 is formed is released, and the lower wiring layer 303 is prevented from fusing and peeling. COPYRIGHT: (C)2006,JPO&NCIPI
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