INSPECTING METHOD AND INSPECTING DEVICE OF WAFER FRONT AND REAR FACE

摘要

PROBLEM TO BE SOLVED: To provide an inspecting method and an inspecting device for a wafer front and rear face capable of a quick and accurate determination of the wafer front and rear face. SOLUTION: The inspecting method for the wafer front and rear face is an inspecting method for the wafer front and rear face formed with a mesa on both the front and rear face. This method comprises an irradiation step of irradiating laser beams 13a on at least one of the front and rear face of a wafer 1; a step of receiving reflected beams 13b of the laser beams 13a; and a determination step of determining the front and rear face of the wafer 1, based on a shape of the reflected beams 13b reflecting a shape of the mesa formed on the front and rear face of the wafer 1. COPYRIGHT: (C)2006,JPO&NCIPI