| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a film carrier tape for electronic component packaging and a solder resist coating apparatus, capable of obtaining a film carrier tape for electronic component packaging in which adhesion strength between an insulating film and an underfill is high and exudation at the end of a solder resist on the side of an inner lead is little. SOLUTION: After a solder resist application solution is applied on a region where a wiring pattern on an insulating film is formed, air is fed substantially perpendicularly to a longitudinal direction of the insulating film to previously dry the solder resist application solution. Then, the insulating film previously dried is superposed on a spacer tape and wound, and then the solder resist application solution is heated, dried, and cured to form a solder resist coated layer. COPYRIGHT: (C)2006,JPO&NCIPI
|
