| 摘要 |
PROBLEM TO BE SOLVED: To form a conductive pattern, while thinning and flattening the conductive pattern by repeating the formation by electroplating and polishing of the conductive pattern. SOLUTION: The method of forming the conductive pattern comprises a process of forming a mask pattern 16 so as to expose only a desired region on the surface of a conductive layer 15 formed on the surface of an insulating base material 10; a process of forming the conductive pattern 17 on the exposed surface of the conductive layer 15; a process of polishing the surface of the conductive pattern 17; and a process of forming the conductive layer further on the polished surface of the conductive pattern 17. COPYRIGHT: (C)2007,JPO&INPIT
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