| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel method of forming a solder layer by which a solder layer can be easily formed on the fine surface of an electrode pad 4 on a flexible printed circuit (FPC) not by solder plating. SOLUTION: First, a printing step is conducted to print a lump of cream solder on an FPC 1. In the printing step, no lump of cream solder is separately printed on each of a plurality of electrode pads 4 on the FPC 1, and one lump of cream solder is applied over the electrode pads 4, or any electrode pad 4 is left while it still has no lump of cream solder on its surface. In the next step of laser irradiation, laser light is applied to solder in the lump of cream solder to melt it, thereby extending over the surface of the electrode pad 4. Thus, a solder layer is separately formed on each of the electrode pads 4 on the FPC 1. COPYRIGHT: (C)2007,JPO&INPIT
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