| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for inspecting an optical semiconductor device capable of shortening an inspection time, preventing an inspection omission, improving a quality and reliability, downsizing an inspection facility, and lowering a facility cost. <P>SOLUTION: An identification mark is provided to an optical semiconductor device 1 by a laser mark unit 13, the optical and electrical characteristics of the optical semiconductor device 1 are inspected at ambient temperature by an ambient-temperature-inspecting unit 15, the optical and electrical characteristics of the optical semiconductor device 1 are inspected at high temperatures by a high-temperature-inspecting unit 17, the optical and electrical characteristics of the optical semiconductor device 1 are inspected at low temperatures by a low-temperature-inspecting unit 19, and the identification mark of the optical semiconductor device 1 is read and recognized by a second image-inspecting unit 20. The optical semiconductor device 1 with the identification mark recognized is selected into a nondefective or defective device on the basis of inspection results of the ambient-temperature-inspecting unit 15, high-temperature-inspecting unit 17, and low-temperature-inspecting unit 19 by a selection unit 52. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
