| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a limited space on a semiconductor substrate can be efficiently utilized and a plurality of electronic components can be disposed on a region other than bumps. SOLUTION: The semiconductor device 1 is provided with at least a first electronic component 6 disposed on one surface of a semiconductor substrate 2 having an electrode 3 disposed on its one surface and electrically connected to a first conductor 4; and plurality of structures 7 disposed around the first electric component. The semiconductor device is further provided with a first laminate 11 disposed on one surface of the semiconductor substrate and between the first electronic component and the structures. The first laminate consists of two or more first insulating layers 12a, 12b, 12c; and one or more first wiring layers 13a, 13b each disposed between the first insulating layers. The first wiring layers are each connected via openings 14, 15, 16 provided on the first insulating layers positioned above and/or below the first wiring layers, and one end of the connected first wiring layer 13a is electrically connected to the electrode 3, and the other end is electrically connected to the first electronic component 6 via the first conductor 4. COPYRIGHT: (C)2008,JPO&INPIT |
