发明名称 THERMOPLASTIC FILMS FOR INSULATED METAL SUBSTRATES AND METHODS OF MANUFACTURE THEREOF
摘要 <p>An insulated metal substrate laminate includes a metal substrate, a dielectric layer disposed upon the metal substrate, wherein the dielectric layer comprises a thermoplastic film having a thickness of less than or equal to 10 micrometers, a thermal resistance of less than or equal to 0.050 Kelvin-square inches per watt, and a breakdown voltage greater than or equal to 1000 volts (alternating current), and an electrically conductive layer disposed upon the dielectric layer.</p>
申请公布号 WO2009029503(A1) 申请公布日期 2009.03.05
申请号 WO2008US73955 申请日期 2008.08.22
申请人 WORLD PROPERTIES, INC.;CHUN, SEUNG, B. 发明人 CHUN, SEUNG, B.
分类号 B32B15/08 主分类号 B32B15/08
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