发明名称 LIGHT EMITTING MODULE AND LIGHTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting module and a lighting device which improve the bonding strength of a sealing member to a substrate and inhibit the peeling of the sealing member. <P>SOLUTION: A light emitting module includes: a substrate; a light emitting element; and a sealing member. The light emitting element is mounted on the substrate. The sealing member is composed mainly of a translucent resin including phosphor particles and has a shape protruding from the substrate. Further, the sealing member has a main part covering the light emitting element and an outer peripheral part contacting with the substrate around the main part. The content rate of the phosphor particle is reduced at the outer peripheral part of the sealing member so as to be lower than that of the main part. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013098389(A) 申请公布日期 2013.05.20
申请号 JP20110240534 申请日期 2011.11.01
申请人 TOSHIBA LIGHTING & TECHNOLOGY CORP 发明人 SHIBUSAWA SOICHI;HAYASHIDA YUMIKO;NAKAGAWA YUIKO;TAMAI HIROTAKA
分类号 H01L33/50;F21S2/00;F21S8/04;F21V9/08;F21V19/00;F21Y101/02;H01L33/54 主分类号 H01L33/50
代理机构 代理人
主权项
地址