| 摘要 |
<P>PROBLEM TO BE SOLVED: To settle the problem that, in a resin composition comprising an aromatic polyisocyanate compound (A), a bisphenol type epoxy resin (B) and an imidazole compound (C), when heating and curing the liquid resin composition having a high isocyanate ratio of ≥2 mole ratio of isocyanate groups to epoxy groups, foams are present in the cured products, and when preparing the resin composition, a gelled body is sometimes generated. <P>SOLUTION: It is found that, in the case of providing a resin composition in which the mole ratio of isocyanate groups to epoxy groups is ≥2, preferably in a range of ≥2 and ≤15, and the compounding rate of (C) relative to the total weight of (A)+(B)+(C) is in a range of 0.2-0.8 wt.%, by stir-mixing (C) and (B), adding (A), stir-mixing again, and vacuum-degassing to prepare, a highly heat-resistant isocyanurated cured product having a glass transition temperature of ≥250°C, forming no gel and containing no bubble in the cured product can be obtained by heat-curing the resin composition. <P>COPYRIGHT: (C)2013,JPO&INPIT |
