| 摘要 |
This semiconductor device is provided with a substrate (1A), beam (12), movable structure (13), first stopper member (S1), second stopper member (S2), and third stopper member (S3). The first stopper member (S1) is disposed by having a first gap (T1) between the movable structure (13) and the first stopper member in the in-plane direction. The second stopper member (S2) is disposed by having a second gap (T2) between the movable structure (13) and the second stopper member in the out-of-plane direction. The third stopper member (S3) is disposed on the side of the movable structure (13) in the out-of-plane direction, said side being the opposite side to the second stopper member (S2), by having a third gap (T3) between the movable structure (13) and the third stopper member. Consequently, the semiconductor device wherein damages and breakage of the beam that supports the movable structure are suppressed by suppressing excessive displacement of the movable structure, and a method for manufacturing the semiconductor device can be provided. |
