发明名称 METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE ADHESIVE FILM, ELECTRICALLY CONDUCTIVE ADHESIVE FILM, AND METHOD FOR MANUFACTURING CONNECTOR
摘要 Electrically conductive particles filled in the openings are securely transferred and attached to the binder resin layer. The invention further includes a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.
申请公布号 US2016280969(A1) 申请公布日期 2016.09.29
申请号 US201414904495 申请日期 2014.07.28
申请人 DEXERIALS CORPORATION 发明人 AKUTSU Yasushi
分类号 C09J9/02;H05K3/36;H01R43/16;C09J7/02 主分类号 C09J9/02
代理机构 代理人
主权项 1. A method for manufacturing an electrically conductive adhesive film, the method comprising: a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern corresponding to an array pattern the electrically conductive particles; a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate; and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.
地址 Tokyo JP
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