| 摘要 |
PROBLEM TO BE SOLVED: To provide a rolling element behavior analysis method that can be applied to analysis of behavior of a rolling element in polishing, and can properly extract a position of a marker and analyze behavior of the marker and rolling element even when the rolling element and marker are not exposed, and a rolling element polishing method using the rolling element behavior analysis method.SOLUTION: A rolling element behavior analysis method comprises: an imaging step of using a rolling element 70 in which a single marker or a plurality of markers 81 formed of a material having different density from that of the rolling element to a smaller size than the rolling element are embedded, and imaging the rolling element in rolling motion in every predetermined timing using a radiographic device 40 to obtain image data; a marker extraction step of extracting markers from the respective image data; a marker behavior analysis step of analyzing behavior of the markers from the marker extracted from the respective image data; and a rolling element behavior analysis step of analyzing behavior of the rolling element having the markers embedded based upon the analyzed behavior of the markers.SELECTED DRAWING: Figure 1 |
