| 摘要 |
<p>A method for manufacturing a printed wiring board in which a copper foil and a resin layer can be machined simultaneously without etching the copper foil when via holes are made in a copper-clad laminate using a carbon dioxide gas laser. Recesses, e.g. via holes (8), are made in a copper-clad laminate (1) using a carbon dioxide gas laser (7), an etching resist layer (10) is formed by performing interlayer electrical connection plating (9), the etching resist layer is exposed and developed and then circuit etching is performed to manufacture a printed wiring board (11). The printed wiring board is manufactured using a copper-clad laminate having a corrugated outer layer copper foil (C).</p> |
