发明名称 ABLATION LAYER, PHOTOSENSITIVE RESIN STRUCTURE, AND METHOD FOR PRODUCING RELIEF PRINTING PLATE USING THE PHOTOSENSITIVE RESIN STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide an ablation layer having such properties that: the layer is not wrinkled by moisture absorption in a high humidity environment even after peeling off a cover film stuck to the ablation layer; a portion of the layer that has been removed with a developing solution can be easily dissolved and dispersed; retention or re-adhesion of a washing residue can be effectively prevented; and the layer can be processed with IR rays. <P>SOLUTION: The ablation layer to be used for a photosensitive resin for relief printing can be processed with IR rays and contains an anionic polymer. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013101394(A) 申请公布日期 2013.05.23
申请号 JP20130024700 申请日期 2013.02.12
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 ISO TOMOSATO
分类号 G03F7/095;G03F7/00;G03F7/004;G03F7/32 主分类号 G03F7/095
代理机构 代理人
主权项
地址