| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a material for forming an electroless plating, which has good catalyst sticking property and from which a catalyst sticking layer is not eluted into a plating solution in a catalyst sticking process, a developing process or the like. <P>SOLUTION: In the material for forming the electroless plating, having the catalyst sticking layer on a non-electroconductive base material, the catalyst sticking layer contains a hydrophilic ionization radiation-curable resin composition and the surface of the catalyst sticking layer is formed to have a contact angle to deionized water of≤60°. Preferably, the catalyst sticking layer is formed so that the hydrophilic ionization radiation-curable resin composition exists in a half-cured state in the layer. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
