SEMICONDUCTOR LAMINATE STRUCTURE, SEMICONDUCTOR DEVICE USING IT AND THEIR MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor laminate structure which is excellent in connection reliability, has high productivity and can achieve thinning by using a conductive resin, a semiconductor device using it and their manufacturing method.

SOLUTION: The semiconductor laminate structure 1 for which at least a first semiconductor chip 10 having a first wiring electrode and a second semiconductor chip 11 having a second wiring electrode are laminated includes at least the first semiconductor chip 10 connected with the second semiconductor chip 11 in a lamination direction and provided with a first conductive via 10d connected with a prescribed first wiring electrode and filled with a conductive resin and the second semiconductor chip 11 connected with the first semiconductor chip 10 in the lamination direction and provided with a second conductive via 11d connected with a prescribed second wiring electrode and filled with the conductive resin. The first conductive via 10d and the second conductive via 11d facing each other are electrically connected through a conductive connector 12.

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