SEMICONDUCTOR PACKAGE

摘要

A semiconductor package is provided to improve yield by suppressing the number of alignment marks arranged in the semiconductor packs to the minimum value. A connection pad(26) connecting a lower package(20) to an upper package is formed in the upper part of a circuit board(22). The connection pad is formed in order to surround an outer edge of a semiconductor device(24). The connection pad includes at least two different-shape pads. The planar shape of the connection pad is circular. The planar shape of the different-shape pad is rectangular. One different-shape pad is rotated based on the central point of the lower package as much as 180 degrees. The rotated different-shape pad is completely coincided with the initial position of the other different-shape pad.