发明名称 MOLDING APPARATUS AND MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a molding apparatus and method, controlling occurrence of weld lines in a molding space having two or more gates. SOLUTION: The molding apparatus has a molding space for formation of a molding, a runner groove communicating with the molding space through a first and a second gate in the molding space to constitute a runner connected to a molding and a molding material injection inlet communicating with the runner groove. The runner groove includes an inflow controlling means of controlling the flowing direction or the inflow of the molding material flowing into the molding space. As the inflow controlling means, the cross section of the first gate may be larger than that of the second gate. As the inflow controlling means, a division member may be also arranged which has such a structure as to allow inflow of the molding material in one direction of the molding material injected from the injection inlet and as to block up inflow of the molding material in the other direction of the molding material injected from the injection inlet. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009132004(A) 申请公布日期 2009.06.18
申请号 JP20070309104 申请日期 2007.11.29
申请人 BANDAI CO LTD 发明人 HAMATAKI TAKAYASU
分类号 B29C45/28 主分类号 B29C45/28
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