| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal base material excellent in solder adhesiveness and weather resistance.SOLUTION: The metal base material with plating material is provided in which: a Co-Ni alloy plating layer, a Co-Mo alloy plating layer or a Co-Ni-Mo alloy plating layer are formed on a part of or all surface of the metal base material; the total adhesion amount of Co, Ni and Mo in the plating layer is 13500 μg/dmor more; the total adhesion amount of Ni and Mo to the total adhesion amount of Co, Ni and Mo (hereafter called as "Ni+Mo ratio (%)" is 10% to 50% by a mass ratio; and the metal base material is formed from titanium copper, phosphorus bronze, Corson alloy, tombac, brass or nickel silver. The metal base material with plating material is used for applications in which the metal base material with plating material is connected to an electronic component by soldering.SELECTED DRAWING: None |
