Method of manufacturing printed circuit board and printed circuit board

摘要

A method of manufacturing a printed circuit board includes: supplying solder paste so as to be offset from an electrode pad of a printed wiring board; flowing the solder paste during melting; and forming a region that is not covered with solder resist on the outer peripheral region adjacent to the electrode pad of the printed wiring board to which solder paste is supplied, thereby increasing a gap between a semiconductor package and the printed wiring board to prevent separation of the solder.

主权项

1. A method of manufacturing a printed circuit board,
the printed circuit board comprising: a first printed wiring board comprising a first electrode pad formed on a surface thereof; and a second printed wiring board comprising a second electrode pad formed on a surface thereof, the first electrode pad and the second electrode pad being joined with solder, the method comprising: forming, on the second printed wiring board: a first region in an outer edge portion of the second electrode pad, which is covered with solder resist; a second region on the second electrode pad wherein the outer edge portion of the second electrode pad is covered with the solder but is not covered with the solder resist; and a third region which is adjacent to the second region and on the second printed wiring board wherein the third region is not covered with the solder resist but a periphery of the third region is surrounded by the solder resist; and joining the first electrode pad and the second electrode pad to each other by: supplying solder paste onto a region extending over the second region and the third region; mounting the first printed wiring board on the second printed wiring board so that the first electrode pad of the first printed wiring board is opposed to the second electrode pad of the second printed wiring board; heating the solder paste to be molten; and causing the molten solder to move from the third region toward the second region.